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APTGT30H170T3G Full - Bridge Trench + Field Stop IGBT(R) Power Module 13 14 VCES = 1700V IC = 30A @ Tc = 80C Application * Welding converters * Switched Mode Power Supplies * Uninterruptible Power Supplies * Motor control Features * Trench + Field Stop IGBT(R) Technology - Low voltage drop - Low tail current - Switching frequency up to 20 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - Avalanche energy rated - RBSOA and SCSOA rated * Kelvin emitter for easy drive * Low stray inductance * High level of integration * Internal thermistor for temperature monitoring Benefits * Outstanding performance at high frequency operation * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Solderable terminals both for power and signal for easy PCB mounting * Low profile * Easy paralleling due to positive TC of VCEsat * Each leg can be easily paralleled to achieve a phase leg of twice the current capability * RoHS Compliant Max ratings 1700 45 30 70 20 210 60A@1600V Unit V July, 2006 1-5 APTGT30H170T3G - Rev 1 Q1 18 19 CR1 CR3 Q3 11 10 22 23 Q2 7 8 CR4 Q4 26 27 CR2 4 3 29 15 30 31 R1 32 16 28 27 26 25 29 30 23 22 20 19 18 16 15 31 32 2 3 4 7 8 10 11 12 14 13 All multiple inputs and outputs must be shorted together Example: 13/14 ; 29/30 ; 22/23 ... Absolute maximum ratings Symbol VCES IC ICM VGE PD RBSOA Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current Pulsed Collector Current Gate - Emitter Voltage Maximum Power Dissipation TC = 25C TC = 80C TC = 25C TC = 25C Tj = 125C A V W Reverse Bias Safe Operating Area These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com APTGT30H170T3G All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics Symbol Characteristic ICES VCE(sat) VGE(th) IGES Symbol Cies Cres Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff Test Conditions Min Zero Gate Voltage Collector Current Collector Emitter saturation Voltage Gate Threshold Voltage Gate - Emitter Leakage Current VGE = 0V, VCE = 1700V Tj = 25C VGE = 15V IC = 30A Tj = 125C VGE = VCE , IC = 1.5mA VGE = 20V, VCE = 0V Test Conditions VGE = 0V, VCE = 25V f = 1MHz Inductive Switching (25C) VGE = 15V VBus = 900V IC = 30A R G = 18 Inductive Switching (125C) VGE = 15V VBus = 900V IC = 30A R G = 18 Typ 2.0 2.4 5.8 Max 250 2.4 6.4 600 Unit A V V nA 5.2 Dynamic Characteristics Characteristic Input Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Min Typ 2500 90 100 70 650 80 100 70 750 100 17 15 Max Unit pF ns ns mJ Reverse diode ratings and characteristics Symbol Characteristic VRRM Maximum Peak Repetitive Reverse Voltage IRM IF VF trr Qrr Er Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Energy Test Conditions VR=1700V IF = 50A VGE = 0V Tj = 25C Tj = 125C TC=80C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Min 1700 Typ Max 250 500 Unit V A A IF = 50A VR = 900V di/dt =800A/s 50 1.8 1.9 385 490 14 23 6 12 2.2 V ns C mJ RT = R 25 1 1 RT : Thermistor value at T exp B 25 / 85 T - T 25 T: Thermistor temperature www.microsemi.com 2-5 APTGT30H170T3G - Rev 1 Symbol Characteristic R25 Resistance @ 25C B 25/85 T25 = 298.15 K Min Typ 50 3952 Max Unit k K July, 2006 Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information). APTGT30H170T3G Thermal and package characteristics Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight IGBT Diode 3500 -40 -40 -40 2.5 Min Typ Max 0.6 0.7 150 125 100 4.7 110 Unit C/W V C N.m g RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz To heatsink M4 SP3 Package outline (dimensions in mm) 1 See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com July, 2006 www.microsemi.com 3-5 APTGT30H170T3G - Rev 1 17 12 28 APTGT30H170T3G Typical Performance Curve Output Characteristics (V GE=15V) Output Characteristics 60 50 40 IC (A) T J=125C VGE =15V 60 50 IC (A) T J=25C T J = 125C VGE =19V 40 30 20 10 0 0 0.5 1 1.5 2 2.5 V CE (V) 3 3.5 4 30 VGE =13V 20 10 0 0 1 2 3 V CE (V) 4 5 VGE =9V 60 50 40 Transfert Characteristics 40 TJ=25C Energy losses vs Collector Current 35 30 E (mJ) 25 20 15 10 5 0 0 20 40 IC (A) Reverse Bias Safe Operating Area 70 60 80 100 Er VCE = 900V VGE = 15V RG = 18 TJ = 125C Eon Eoff IC (A) 30 20 10 0 5 6 7 8 VGE (V) 9 TJ=125C T J=125C 10 11 Switching Energy Losses vs Gate Resistance 80 VCE = 900V VGE =15V IC = 30A TJ = 125C Eon 60 50 IC (A) 40 30 20 10 0 0 VGE =15V TJ=125C RG=18 60 E (mJ) 40 Eoff 20 Er 0 0 20 40 60 80 100 Gate Resistance (ohms) 120 400 800 VCE (V) 1200 1600 0.7 Thermal Impedance (C/W) 0.6 0.5 0.4 0.3 0.2 0.1 0 0.00001 0.5 0.3 0.1 0.05 0.9 maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration IGBT Single Pulse 0.0001 0.001 0.01 0.1 1 10 rectangular Pulse Duration (Seconds) www.microsemi.com 4-5 APTGT30H170T3G - Rev 1 July, 2006 0.7 APTGT30H170T3G Operating Frequency vs Collector Current Fmax, Operating Frequency (kHz) 45 40 35 30 25 20 15 10 5 0 0 10 20 30 IC (A) 40 50 60 0 0 0.5 1 1.5 VF (V) 2 2.5 3 ZCS hard switching ZVS VCE=900V D=50% R G=18 T J=125C T C=75C Forward Characteristic of diode 100 80 60 TJ=125C TJ=25C IF (A) 40 20 T J=125C maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 1 Thermal Impedance (C/W) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.9 0.7 0.5 0.3 Single Pulse 0.0001 0.001 0.01 0.1 1 10 Diode 0.1 0.1 0.05 0 0.00001 rectangular Pulse Duration (Seconds) Microsemi reserves the right to change, without notice, the specifications and information contained herein Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 5-5 APTGT30H170T3G - Rev 1 July, 2006 |
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